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Description
Wafer Size 150mm Circular. Rectangular Substrates must fit inside 150mm circle. Indexing Accuracy 1.0 Micrometer. Cumulative Accuracy 1.5 Micrometer. Cut Depth Accuracy 2.0 Micrometer. Rotatary Axis Accuracy 4arc Seconds. Feed Rate 350mm per Second . Camera Magnification up to 120x. Blade Dia. 50-76mm. Spindle Speeds up to 60000rpm. Year 2003
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